Process Engineer for Thin-Film Electronics
We are seeking a highly skilled Process Engineer to join our dynamic team in the development of innovative technologies for panel-level process technology and fan-out packaging.
Your main responsibilities will include :
- Developing new processes and integrated process flows for the realization of functional chip packages;
- Testing and analyzing developed process flows versus functional specifications;
- Reporting on technical progress and results in internal meetings and with external stakeholders;
- Supporting technical program roadmaps and projects from a process engineering and equipment engineering perspective;
- Closely collaborating with team members to ensure alignment on requirements and process development.
As a Process Engineer, you will play a key role in shaping the future of thin-film electronics and contribute to the development of cutting-edge technologies.
Required Skills and Qualifications
To be successful in this role, you will need :
A background in chip packaging and / or thin-film technologies and their application in functional devices;Several years of hands-on experience in process engineering within cleanroom and R&D settings;Closely coordinate with colleagues in the Thin-Film Electronics team and TNO at CITC, particularly with the cleanroom engineering team;Strong analytical and problem-solving skills;Excellent communication and collaboration skills.Benefits
This role offers the opportunity to work in a dynamic and collaborative environment with a multidisciplinary team. You will have the chance to develop your skills and expertise in a field that is constantly evolving.
Key Competencies
In addition to the required skills and qualifications, we are looking for someone who possesses :
Strong technical knowledge of process engineering and equipment engineering;Ability to work independently and as part of a team;Excellent time management and organizational skills;Strong attention to detail and quality focus.