Project Lead Laser Integration

Project Lead Laser Integration

Project Lead Laser Integration

Research & development - Eindhoven | Just now

As a Project Lead Laser Integration, you will contribute to developing photonic solutions for a wide range of different research projects including Laser, Hybrid integration, LiDAR, Co-Packaged Optics, Datacom, and Biosensors. This starts with identifying and enabling photonic packaging paths for integrated photonics in collaboration with internal and external partners. With these packaging paths, you manage efficient operation of the packaging processes and develop next-generation photonics packaging technologies.

Project Lead Laser Integration

Who can take the lead in developing packaging technologies and building packaging paths for integrated photonics.

What you will do

As a Project Lead Laser Integration, you will contribute to the development of cutting-edge photonic solutions across diverse research projects, including lasers, hybrid integration, LiDAR, co-packaged optics, datacom, and biosensors. Your responsibilities will begin with identifying and establishing photonic packaging pathways for integrated photonics, working in close collaboration with both internal and external partners. Utilizing these packaging pathways, you will oversee the efficient operation of packaging processes and spearhead the development of next-generation photonics packaging technologies.

As a Project Lead Laser Integration, you will be part of our interdisciplinary team. In this position, you will have a key and visible role in this initiative. Your main tasks will be :

• Play a lead role in Laser integration packaging for integrated photonics including other III-V to Silicon (Nitride) packaging strategies.
• Take ownership of planning, scheduling, and execution of packaging campaigns as well as performance and yield analysis.
• Co-ordinating the established packaging paths with internal and external partners and Monitoring progress by analyzing mass data sets.
• Creating new packaging paths to achieve operational excellence and meet new demands.
• Develop next-generation packaging and integration technologies for emerging applications.
• Demonstration and validation of packaged chips in a lab environment.
• Share insights and experiences with the team and contribute to the development and maturity of packaging process.
• Communicate with internal and external partners to identify and leverage synergies.
• Be responsible for managing different packaging strategies.
• Prepare technical notes and documentation for internal and external customers. Optionally, file patents or publish your work.

What we do for you?

We offer a challenging environment at the forefront of technology, in an international network of renowned industrial customers. This is your opportunity to bring new technologies to the market that will have an impact on tomorrow’s society.

Imec The Netherlands, as an employer of choice, offers you an attractive compensation and benefits package including a 100% employer-paid pension plan and flexible working hours. Furthermore, imec-NL offers a wide range of training possibilities. For international candidates, we provide support in the relocation process.

By joining the R&D team in Eindhoven, you will be part of a team of disruptive innovators and thinkers. Together, with our researchers and engineers, you will work on a variety of topics, including healthcare, agrifood, mobility and communications. We invite you to be part of our ambitious team where your ideas will have an impact on our society and our future lives.

Who you are

Interested

Does this position sound like an interesting next step in your career and do you want to work on making societal impact? Don’t hesitate to apply today by submitting your full resume and motivation letter. Do you have any questions about this position? Then you can contact Mayuri Nalawade, our Talent Acquisition Specialist. You can reach Mayuri by email at

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